Responsible for leading Process Engineering activities within Semiconductor Assembly and Test Operations. This role drives process excellence, product qualification, continuous improvement, and manufacturing performance through effective leadership, process validation, risk management, and cross-functional collaboration to support business, operational, and customer requirements.
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Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
Develop and implement process improvements to enhance yield, reliability, and throughput. Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
Collaborate with design, quality, and manufacturing teams to support new product introductions.
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Lead and manage the process engineering team, providing engineering support to the manufacturing line to achieve best-in-class quality, yield, cost, and cycle time.
Provide technical leadership and timely solutions for day-to-day manufacturing issues.
Lead the process engineering team in optimizing wafer fabrication processes using Design of Experiments (DOE), statistical analysis, and data-driven methodologies to improve yield, cost, quality, and cycle time.
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
...
Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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