Lead package engineering development for Substrate-Based Power Modules, Flip-Chip, Multi-Chip Modules (MCM), and System-in-Package (SiP) architectures targeting AI acceleration and data center applications.
To ensure all turret tester safe to operate with high availability, good reliability & appropriate quality performance and hence to ensure KPI Defined Fulfilled.
Responsible for yield stability & improvement, ensure quality and reliability of delivered products meeting IFX quality standard (SBA, LOH assessment and disposition) and support new product release, production ramp and change management projects
Develop and define comprehensive maintenance programs to ensure all equipment, including metrology equipment, is safe to operate, highly available, reliable, and capable of delivering the required quality performance