Support and participate in the repair of production defective PCBA boards, following established procedures and guidance.
Assist with NPI build activities, including basic debugging, analysis, and repair of defective boards, as part of cross-functional support.
Work closely with the product engineering team to help identify and resolve production-related issues, including those arising from SMT and PCBA assembly processes.
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Participate in the repair of production defective PCBA boards, following established procedures and guidance.
Response for failure analysis activities and repair machine (ex. BGA machine, tooling…etc) for defective boards. Collaborate with R&D on critical non-conformance (NG) symptoms were required.
Response for preparing failure analysis reports, repair records, and related documentation, contributing to traceability and continuous improvement efforts.
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Participate in the repair of production defective PCBA boards, following established procedures and guidance.
Response for failure analysis activities and repair machine (ex. BGA machine, tooling…etc) for defective boards. Collaborate with R&D on critical non-conformance (NG) symptoms were required.
Response for preparing failure analysis reports, repair records, and related documentation, contributing to traceability and continuous improvement efforts.
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Become a contributing member in the failure analysis of our Sandisk products to increase customer satisfaction.
Perform failure analysis on Sandisk products while interacting with many engineering groups such as NAND, firmware, systems, ASIC, etc.
Evaluate the electrical and mechanical characteristics of systems, integrated circuits, components, and sub-components to determine the cause of failure including the verification of analog and digital performance.
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