R&D Collaboration & Tool Qualification. Partner with R&D teams to support probing and testing tool qualification. Evaluate new test methods, tools, and technologies to ensure readiness for production. Provide technical feedback to improve test coverage, accuracy, and efficiency.
Sustaining & Process Improvement. Work closely with sustaining engineering teams on maintenance strategies and process-related issues. Drive continuous improvement initiatives to enhance yield, quality, and test efficiency. Troubleshoot test-related issues and implement corrective/preventive actions.
Risk Management & Process Control. Conduct risk assessments for test processes and equipment. Develop and maintain Control Plans to ensure process stability. Create and implement OCAP (Out of Control Action Plans). Prepare and maintain detailed Work Instructions for test operations.
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Designing, realization and evaluation of AlInGaN based semiconductor chips
Special focus on innovative approaches towards high performance/high current LEDs
Development of novel or optimized process flows for chip manufacturing in strong cooperation with process development and manufacturing in global teams
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Provides highly visible customer support through the performance of on-site installation, as well as overseeing any necessary diagnoses, troubleshooting, service, and repair of complex equipment and systems. Checks out and approves operational quality of system equipment. Instructs customers in the operation and maintenance of the system. Serves as company liaison with customer on administrative and technical matters for assigned projects. Interprets customers’ needs and clarifies if the responsibility for problem resolution falls to sales personnel, customer support reps, or engineers. This job may include any aspect of field support, and is not limited to system hardware and software, PCs, and networking/wireless networking. This job provides customer support.
Education/Experience: Typically requires a Bachelor's degree with 2-4 years of professional experience.
Perform Discrete Devices and PCM Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate and present FA results in cross functional meetings and yield improvement.
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To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To sustain and optimize dicing/ grinding/ LLO/ Bonding process & equipment for continue improvement, countermeasures issue, ensuring tool maximum productivity, new product qualification & release.
Lead, develop and optimize dicing/ grinding / LLO/ Bomding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirement
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To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
Designing, realization and evaluation of AlInGaN based semiconductor chips
Special focus on innovative approaches towards high performance/high current LEDs
Development of novel or optimized process flows for chip manufacturing in strong cooperation with process development and manufacturing in global teams
...
Designing, realization and evaluation of AlInGaN based semiconductor chips
Special focus on innovative approaches towards high performance/high current LEDs
Development of novel or optimized process flows for chip manufacturing in strong cooperation with process development and manufacturing in global teams
...
Designing, realization and evaluation of AlInGaN based semiconductor chips
Special focus on innovative approaches towards high performance/high current LEDs
Development of novel or optimized process flows for chip manufacturing in strong cooperation with process development and manufacturing in global teams
...
A leading global manufacturer seeks a Technology Development Engineer in Kulim Hi-Tech Industrial Park, Malaysia. Ideal candidates will have an engineering degree and at least 2 years of experience in PCB/ICS/Assembly, with strong project management and analytical skills. This role involves leading engineering tasks, guiding teams, and coordinating new project feasibility.
Excellent communication abilities are essential, as is a willingness to adapt in a diverse work environment. Competitive compensation and growth opportunities are provided.
We are looking for a technology development engineer who will be driving innovations on technology, device and system level, shaping the next generations of High-Voltage Power Devices as part of a global development team
Develop new voltages classes and broadening the functionality of the existing products
Support the ramp up and yield learning phase of new technology platforms like CoolSiC or JFET together with the process integration group
...
We are looking for a technology development engineer who will be driving innovations on technology, device and system level, shaping the next generations of High-Voltage Power Devices as part of a global development team
Develop new voltages classes and broadening the functionality of the existing products
Support the ramp up and yield learning phase of new technology platforms like CoolSiC or JFET together with the process integration group
...