Serve as the principal technical expert for wafer backgrind, thinning, and metallization processes in preparation for die assembly and final test.
Provide deep technical guidance across wafer fabrication, back‑end assembly and packaging, final electrical testing, and reliability qualification.
Support yield learning, defect reduction, and root cause investigations using semiconductor failure analysis techniques, advanced data analytics, and pattern recognition approaches.
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Monitor and oversee quality control activities for electrical installation works on data center construction projects.
Conduct inspections of electrical systems, equipment, materials, and installations to ensure compliance with project specifications and quality standards.
Review electrical drawings, technical specifications, method statements, and inspection test plans (ITPs).
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Supervise and coordinate daily site construction activities to ensure work is carried out according to approved drawings, specifications, quality standards, and project schedules.
Monitor contractor and subcontractor performance to ensure project milestones are achieved safely and efficiently.
Coordinate with consultants, project managers, engineers, and site teams to resolve technical and construction-related issues.
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5+ years’ experience in an electronics or electro-mechanical laboratory environment.
Ability to translate schematics, block diagrams and verbal descriptions into functioning hardware, and willingness to ask questions, seek clarification, and give guidance to senior colleagues when needed.
Skilled with typical electronics lab equipment such as oscilloscopes, LCR meters, waveform generators, current probes, high voltage/high current power supplies, handheld meters, soldering, PCB troubleshooting.
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Certificate or Diploma in Air Conditioning, Refrigeration, or Mechanical Engineering from a recognized institution (e.g., Polytechnics, Technical Institutes, or Community Colleges).
Some employers may also accept candidates with a SKM (Sijil Kemahiran Malaysia) in Air Conditioning and Refrigeration (Level 2 or 3).
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Work together with Product Engineering team and manufacturing test engineering team to support new product development and its smooth transition to mass production in multiple manufacturing sites.
Develop and implement test software & hardware for high voltage, high power semiconductor module and discrete, primarily in the area of final test
Develop test coverage to ensure no test escapees
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System owner for Facilities Mechanical System including HVAC, Compressed Dry Air, Vacuum, Process Cooling, Exhaust and Cleanroom.
Provide technical guidance to manufacturing, safety and project team on mechanical system capabilities, concern and troubleshooting.
Act as project coordinator for replacement, upgrading, expansion or modification of buildings, utilities and services within the wafer fab related to mechanical system.
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Design, develop, modify, and integrate hardware and software solutions to enhance operational efficiency through improvements in OEE, quality, and overall productivity.
Implement and deploy automation technologies, including robotics, automated vision systems, material-handling robots, and AI/Machine Learning software, into production IoT ecosystems.
Upgrade and enhance existing tools and systems to achieve objectives and meet requirements established by both internal and external stakeholders.
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Bachelor’s Degree in Automation Engineering, Electrical Engineering, Electronics Engineering, Mechatronics Engineering, Control Engineering, or a related discipline.
Minimum 3 years of relevant experience in industrial instrutmentation, process control, power generation, manufacturing or a similar plant environment.
Hands-on experience with PLC, DCS, HMI, SCADA and industrial control systems.
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