Manage/process customer orders, product returns, quotations, inbound and outbound customer calls to resolve customer queries/issues, as well as pre-sales and post-booking activities.
Understand and interact with a variety of NI departments, processes, and applications to support customer needs to drive velocity and remove roadblocks.
Support sales opportunity management cycle for customers by fulfilling operational requests.
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Lead strategic development and management of strategic suppliers—including PCA Contract Manufacturers and PCB fabricators—driving world-class performance across technology, quality, cost, and supply chain optimization. Champion innovative approaches to enable resilient, scalable, and simplified material supply chains.
Serve as a technical authority and consultant across cross-functional teams (R&D, Production, Procurement, and Product Engineering), applying deep expertise in materials science, PCB/PCA manufacturing processes, and NPI/transfer execution to influence product design, material selection, sourcing strategies, and qualification standards.
Own end-to-end supplier quality and material lifecycle management, including part qualification, risk mitigation, and continuous improvement initiatives to ensure robust product performance and compliance.
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Work through various nodes of supply chain in contributing to the superior customer experience by ensuring on time delivery, while optimizing manufacturing resources and supply chain performance.
Define mid and long term plan for production based on forecast and order trend.
Support Product Line on monthly and quarterly shipment projection, backlog profile, and shipment commit.
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Develop and validate AI/ML/Mathematical models (physics-based and data-driven) performance. Establish full data pipeline from end-to-end
Design and optimize processing algorithms including signal processing, ML/AI techniques selection, feature extraction and threshold calibration with guardrails
Containerize and deploy model inference on edge or on-prem compute with zero or minimal-downtime operation
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Maintenance Strategy: Plan, prioritize, and manage maintenance programs, shutdowns, and emergency repairs for critical mechanical assets including HVAC and high-pressure compressor systems.
Process Improvement: Develop and implement repair and maintenance procedures that optimize the use of tools and equipment to enhance the capabilities of the mechanical team.
Utility Operations: Plan and manage facility operation functions, ensuring all mechanical utilities support production with minimal disruption.
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Requirements gathering, analysis document and design/improve EI & Automation solution for manufacturing. Develop, implement and maintain required EI & Automation Solution.
Work closely with CIM/IT/Production/Product/Process Engineer to resolve any technical MES/EI/Automation/Mapping related issues.
Prepare training materials and train business users on MES/Equipment Integration/Automation related system. Execute user acceptance testing (UAT) with Key users/ users.
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SIGNOFF SEMICONDUCTORS PVT. LTD. in Bayan Lepas, Malaysia, seeks a Physical Design Senior Engineer to lead the PD flow from RTL to GDSII for complex blocks, drive floorplanning, CTS, routing and signoff, and collaborate with multi-disciplinary teams.
Ideal candidates have 6–9 years of ASIC/SoC experience, strong PD tool expertise (Innovus, Tempus, Calibre), and a track record in PPA optimization, low-power design, and multi-voltage/multi-frequency projects.
1) Candidate must possess at least a Advanced/Higher/Graduate Diploma, Bachelor's Degree, Post Graduate Diploma, Professional Degree, Engineering (Electrical/Electronic), Engineering (Industrial), Engineering (Mechanical), Engineering (Others) or equivalent.2) At least 3 year(s) of working experience in the above field and relevant experience in LED background.3) Required skill(s): MS PowerPoint, MS Word & MS Excel.4) Preferably specializing in Engineering - Electrical or equivalent.5) Applicants must be willing to work in any subsidiary of Globetronics based in Bayan Lepas, Penang, Malaysia.
Job Descriptions:- Hands on Experience in LED product - FOL (Wire Bond & Die Attach) / EOL / Testing / SMT processes.
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Malaysia Airports Berhad is seeking a Design Manager to lead and coordinate design activities across architectural, structural, and MEP disciplines for complex airport projects. You will act as the client-side design integrator, overseeing consultant outputs and BIM development to maintain design integrity.
Responsibilities include leading design reviews, coordinating with authorities, and ensuring constructability, coordination, and schedule alignment.
Research, evaluate, and source potential suppliers, comparing quotations to ensure the best quality, pricing, and overall value for the company.
Negotiate pricing, payment terms, delivery schedules, and commercial conditions with suppliers to secure favorable agreements.
Process and manage purchase requisitions efficiently, including sourcing, price comparison, issuance of purchase orders, and preparation of related documentation.
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Lead and coordinate internal and external audit and taxation activities, including planning, preparation, review, and statutory filings. Act as the primary liaison with auditors, tax agents, and regulatory authorities throughout audit and tax processes, and conduct post-audit and tax-closing reviews to communicate outcomes and drive continuous improvement.
Ensure full statutory, regulatory, and legal compliance for financial reporting, audit, and taxation by liaising with relevant authorities and proactively monitoring changes in local regulatory requirements.
Design, implement, and maintain robust finance internal control frameworks to ensure accurate, timely, and compliant financial administration in accordance with related company policies and governance standards. Monitor control effectiveness, identify compliance gaps, and drive timely remediation.
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SIGNOFF SEMICONDUCTORS PVT. LTD. in Bayan Lepas, Malaysia, is seeking a Physical Design Lead Engineer to lead the PD flow from RTL to GDSII for complex subsystems.
The role requires 10+ years in ASIC/SOC PD and 1+ year in a lead position, with strong experience in PD tools and sub-system integration. You will drive floorplanning, CTS, routing, and signoff, while mentoring junior engineers.