Process Engineering Trainee (Physical Vapor Deposition - PVD) - GRIT Traineeship
- The trainee will undergo structured on-the-job training within the Physical Vapor Deposition (PVD) Process Engineering team in a 300mm semiconductor wafer fabrication facility. The programme aims to equip the trainee with fundamental knowledge and practical skills in semiconductor manufacturing, process monitoring, statistical process control (SPC), data analysis, problem-solving methodologies, and continuous improvement. Under the guidance of experienced engineers, the trainee will support process monitoring activities and participate in improvement projects to enhance manufacturing quality, yield, and productivity.
16 days
