Project lead for new equipment or improvement action.
Follows up on LOH improvement actions, monitor effectiveness & close loop to MEEQ teams.
Continuously identify the equipment risks and update using EFMEA. Escalate issues detected, developing reject trends and close the EFMEA action as planed.
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Design, develop, modify, and integrate hardware and software solutions to enhance operational efficiency through improvements in OEE, quality, and overall productivity.
Implement and deploy automation technologies, including robotics, automated vision systems, material-handling robots, and AI/Machine Learning software, into production IoT ecosystems.
Upgrade and enhance existing tools and systems to achieve objectives and meet requirements established by both internal and external stakeholders.
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System owner for Facilities Mechanical System including HVAC, Compressed Dry Air, Vacuum, Process Cooling, Exhaust and Cleanroom.
Provide technical guidance to manufacturing, safety and project team on mechanical system capabilities, concern and troubleshooting.
Act as project coordinator for replacement, upgrading, expansion or modification of buildings, utilities and services within the wafer fab related to mechanical system.
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Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
Develop and implement process improvements to enhance yield, reliability, and throughput. Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
Collaborate with design, quality, and manufacturing teams to support new product introductions.
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Design, develop, assemble, integrate, and test custom FPV drone systems, including frame selection, propulsion systems, motors, ESCs, flight controllers, batteries, radio systems, FPV video systems, GPS, telemetry, and supporting electronics.
Develop and optimise UAV platforms for various applications, including airframe integration, navigation systems, communication systems, payload integration, autonomous capabilities, system validation, and operational readiness.
Configure, programme, and optimise flight control systems using Betaflight, INAV, and ArduPilot, including firmware configuration, CLI setup, ESC configuration, receiver integration, GPS setup, telemetry, Blackbox logging, and autonomous flight functions.
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Ensure all incoming and outgoing products strictly meet company specifications, evaluate analytical results, validate testing methods, and authorize the final release of finished products.
Halt product release if process or product deviations occur, lead root-cause investigations, and implement effective corrective actions to resolve customer complaints and quality issues.
Manage, calibrate, and perform internal servicing on quality control devices (e.g., gas analyzers), and plan external preventive maintenance schedules to ensure equipment accuracy.
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Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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