Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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To efficiently deliver high‑quality stress data to enable effective decision making and risk assessments for technology development, product qualification, and production support.
To execute flawlessly on the hardware design development & deliver to committed cycle-time
To provide engineering support to setup of specific Reliability test and train lab personnel accordingly.
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Manage reliability qualification and risk assessments for backend assembly manufacturing changes affecting IC and discrete semiconductor devices.
Define, review, and execute change‑driven reliability qualification plans to support factory sustaining operations and continuous improvement initiatives.
Provide technical reliability risk assessments for manufacturing changes, quality excursions, and customer‑reported issues.
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We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM equipment and front end assembly processes.
Responsibilities
Technician Leadership: Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs. Machine Issue Follow-up : Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution. Equipment Maintenance & Calibration : Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime. Process Optimization : Monitor Overall Equipment Effectiveness (OEE),Uptime,production time. Documentation : Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.
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System owner for Facilities Water System including Wastewater Treatment, Sewage and RODI.
Provide technical guidance to manufacturing, safety and project team on water system capabilities, concern and troubleshooting.
Act as project coordinator for replacement, upgrading, expansion or modification of buildings, utilities and services within the wafer fab related to water system.
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Develop a basic understanding of the manufacturing and support systems and site culture.
Begin to identify, and work with leadership to prioritize, opportunities for improvement in the CVD area.
Demonstrate an understanding of current practices and specifications and develop an actionable plan for continuous improvement, yield improvement, cost savings, projects, etc.
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