Perform Discrete Devices and PCM Failure Analysis on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
...
Responsible for the process of MOCVD thin film epitaxy growth, assures the operability and operational goals by sustaining and continuous improving the processes. Key KPIs include epitaxy layer performance, cost, yield, CpK, other process related KPI.
Full responsibility of MOCVD thin film epitaxy growth process. Actively liaise with production and analytic team to ensure smooth operation and meeting process KPIs.
Work closely with equipment/production team to ensure proper equipment handshake to upkeep the uptime and also quality of the wafers. Sustain the running of the equipment, daily monitoring of process parameters and addressing line operation or analytical related issues.
...