Oversee all aspects of engineering projects, including continuous process improvement, ensuring they are completed within the desired timeframe and budget.
Working and interacting with a wide variety of NI staff and NI Alliance partners in semiconductor test engineering, test program structure, hardware design, and fixture design in support of customer solutions.
Work closely with HOD to set up an organizational structure within BMI addressing core manufacturing processes and the consequences for related technical training.
Determining the core aspects and success criteria for automation solutions in the area of packaging. Responsible for the technical leadership of one or more engineers in the same thematic field according to the Corporate Rules of Governance.
Reliability Analysis (EMIR): Perform rigorous Electromigration (EM) and IR Drop analysis to ensure long-term reliability and power integrity of high-current density paths.