Develops SSD assembly and IC packaging material and processes to meet NBM new business model quality, reliability, cost, yield, productivity and manufacturing requirements.
3D NAND test solution design, assessment, development, and maintenance, including hardware, software, and data analysis. R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms.
Breakthrough on cost reduction and optimization methodology & process through big data analytic/4IR such as House of Cost, Cost Entitlement/Zero Based Budgeting, VPT.