Participate in and manage research activities with the Principal Investigator (PI), Co-PI and project team to ensure that milestones, technical performance measures and deliverables are met.
Perform routine and periodic inspections on building services/facilities, submit reports or defect lists to the manager, and carry out necessary rectifications.
Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.
Perform routine and periodic inspections on building services/facilities, submit reports or defect lists to the manager, and carry out necessary rectifications.
Perform routine and periodic inspections on building services/facilities, submit reports or defect lists to the manager, and carry out necessary rectifications.
Administer, monitor, support, and maintain Microsoft 365 security and workplace technology services, providing escalated troubleshooting for complex operational and security issues.