Process Architecture: Lead the design and optimization of advanced plating processes (including NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
Root Cause Analysis: Tackle complex, localized process defects—such as thickness non-uniformity or interfacial passivation—using advanced analytical tools (SEM/EDX, AFM).
Technology Scaling: Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
...
Process Architecture: Lead the design and optimization of advanced plating processes (including NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
Root Cause Analysis: Tackle complex, localized process defects—such as thickness non-uniformity or interfacial passivation—using advanced analytical tools (SEM/EDX, AFM).
Technology Scaling: Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
...