Identify new methods and techniques to maintain and improve produces whilst reviewing existing processes to enhance process repeatability, reliability and reduce downtime
Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
Technical expert for front- and back-end manufacturing of silicon semiconductors: Support volume ramp-up of production and support efficiency at manufacturing at internal and external sites. Technical support of Industrial projects running on site
Lead complex testing, retests, correlation, and characterization runs on ATE platforms (e.g., ETS88, J800, Magnum and uParset) across temperatures (e.g., -40C, 25C, 125C).Perform first-level debug of test and hardware issues, including sockets, load boards, handlers, and contact problems, and escalate with clear findings.Set up and operate lab equipment such as oscilloscopes, multimeter, signal generators, and automated testers and also able to provide remote assistant activity with counterpart.Plan and prioritize lab workload with minimal supervision, balancing urgent task and retest against routine work.Always ensure proper ESD control and handling practices.Perform first-level analysis of test data, including outlier screening, temperature-coefficient and trend check across temperatures, and comparison against time-zero data.Recommend next steps to engineers (e.g., retest issue, suspected test versus device issues, etc.).Register, update, and close tasks in the Engineering Action Request (EAR) system, and keep lab logs, test reports, and equipment records current.Help improve lab procedures, checklists, and work instructions.Support equipment calibration, preventive maintenance, and audit readinessSupport provide Exensio dataKnowledgeable in read point process and also familiar with Customer Return Unit testing.Diploma in Electrical/Electronic Engineering, Microelectronics, or a related field.5+ years of experience in ATE testing, reliability, or product engineering support in a semiconductor environment.Work in ShiftExcellent communication and teamwork abilitiesStrong knowledge of IC testing, electrical measurements, and reliability concepts.Set up and operate lab equipment such as oscilloscopes, multimeters, environmental chambers, signal generators, and automated testers.Strong ATE platform and test program experience, with hands-on hardware troubleshooting skills.Good judgment in separating test-related issues from true device issues.Strong attention to detail, traceability discipline, and record-keeping.Clear written and verbal communication with engineers, vendors and TPE team.Ability to prioritize multiple tasks, work independently, and meet tight deadlines.Coaching and leadership skills.
Develop and execute sourcing strategies for direct materials, particularly metal commodities, to achieve cost, quality, delivery, and supply continuity objectives.
Technical expert for front- and back-end manufacturing of silicon semiconductors: Support volume ramp-up of production and support efficiency at manufacturing at internal and external sites. Technical support of Industrial projects running on site
Lead complex testing, retests, correlation, and characterization runs on ATE platforms (e.g., ETS88, J800, Magnum and uParset) across temperatures (e.g., -40C, 25C, 125C).
Develop and execute sourcing strategies for direct materials, particularly metal commodities, to achieve cost, quality, delivery, and supply continuity objectives.
Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
Identify new methods and techniques to maintain and improve produces whilst reviewing existing processes to enhance process repeatability, reliability and reduce downtime