Support the Deputy CLO in strategic corporate projects in the field of Corporate/M&A, Finance, Tax and Treasury (which includes M&A, investments, strategic co-operations (including R&D), intercompany agreements, treasury and insurance matters).
Legal support to Nexperia's expansion plans in Malaysia and Philippines (procurement etc) including site specific matters.
Corporate legal support across all Nexperia companies in the entire APAC Region (including setting up new companies, corporate housekeeping and ESG).
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Support the Deputy CLO in strategic corporate projects in the field of Corporate/M&A, Finance, Tax and Treasury (which includes M&A, investments, strategic co-operations (including R&D), intercompany agreements, treasury and insurance matters).
Legal support to Nexperia's expansion plans in Malaysia and Philippines (procurement etc) including site specific matters.
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Own and develop the APAC HR service delivery operating model, including SSC and country interfaces, with clear governance and accountability structures
Translate global HR strategy into regional priorities, roadmaps, and performance targets aligned to business needs
Lead HR Operations service delivery across the full employee lifecycle, ensuring standardized and high-quality execution
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This role is part of the Product Quality Management & Engineering team within the Integrated Circuit Solutions (ICS) business group. The team is responsible for ensuring the quality and reliability of analog and mixed-signal IC products used across automotive, industrial, consumer electronics, IT, and telecommunications applications.
As a Product Quality (Customer Complaint) Engineer, you will focus on managing and investigating customer-reported product issues. You will act as the technical interface between customers, quality teams, and internal engineering functions to drive failure analysis, identify root causes, and implement effective corrective and preventive actions.
In addition to customer complaint handling, the role supports broader product quality activities such as data analysis, reliability monitoring, and New Product Introduction (NPI) support to improve product robustness and maintain strong customer trust.
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Nexperia is a world-class company in semiconductor development and in-house production. We form a global network of talent, with passion and performance, perseverance and professionalism. Join TeamNexperia and become part of a leading company that supports, rewards and challenges you equally, in a dynamic environment, working for world-class results. Talk to us today and learn your true capabilities in an energetic company where you will develop and thrive, the Efficiency Company – Nexperia.
We are looking for a motivated and enthusiastic Finance Trainee to join our team.
Assist in daily finance and accounting activities
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We are looking for a motivated and enthusiastic Test Development Intern to join our engineering team in Seremban. This internship offers hands-on exposure to semiconductor test development, automation, data analysis, and production support within a fast-paced manufacturing environment.
Candidates with knowledge or interest in Artificial Intelligence (AI) and data-driven engineering solutions are highly encouraged to apply.
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The Application Engineer is responsible for enabling packing method design to meet Functional Requirement Specifications (FRS) and manufacturing excellence of Nexperia product development projects, assure post assembled product quality at storage and transportation environment, ultimately customer ease of handling product packing method that is in accordance with EIA or/and IEC Standards.
Develop packing method in terms of carrier tape, cover tape, PQ/SPQ label, inner box..MBB etc being optimal design at aspects of Nexperia design requirements, EIA/IEC Standard, supplier capabilities and customer application in a timely manner.
Identify technical risks and provide mitigation proposals at the appropriate stage using proper design tools such as Design FMEA and Fitting Simulation Analysis.
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We are seeking an experienced End User Support (EUS) Manager to drive our global End User Computing (EUC) strategy and operations. This role will lead the Modern Workplace roadmap, oversee L2 support operations, and ensure a secure, seamless, and productive digital experience for employees across the organization.
You will play a key role in enabling digital transformation, supporting hybrid work environments, and implementing secure, AI-enabled workplace solutions while leading a high-performing support team.
We are seeking a senior strategic leader to oversee the organization’s cloud infrastructure, hosting environments, and data center operations. This role is responsible for driving cloud strategy and modernization initiatives, managing multi-cloud and hybrid environments, and ensuring business continuity and disaster recovery.
The Cloud & Hosting Manager will lead a team of cloud and infrastructure engineers, ensuring the delivery of secure, scalable, cost-efficient, and compliant infrastructure that supports all business applications and services.
We are looking for a Front End Equipment Engineer to support and sustain manufacturing equipment performance within the front-end wafer fabrication area. This role is responsible for ensuring high equipment uptime, reliability, and process stability to meet production targets and quality standards.
The ideal candidate will work closely with production, process engineering, and maintenance teams to drive continuous improvement, cost reduction, and operational excellence.
Monitor and improve equipment performance, uptime, and OEE (Overall Equipment Effectiveness).
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As a Senior Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.What You Will Do
Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
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As a Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.
What You Will Do
Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma
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The position requires strong technical hands-on capability, data-driven problem solving, and close collaboration with cross-functional teams. The engineer will act as a key technical owner, driving continuous improvement, supporting new product introductions, and implementing robust controls to prevent process and equipment-related failures.
Own and sustain Die Attach and Wire Bond processes and equipment, ensuring stable operation, high OEE, and compliance with process specifications.
Manage tooling setup, calibration, alignment, and qualification activities.
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We are looking for an EDA Engineer to support and enhance the design environment across business groups. This role focuses on evaluating, implementing, and supporting EDA tools and design flows, while driving efficiency and innovation in engineering design processes. You will act as a key consultant to designers, helping improve workflows and align solutions across teams.
What You Will Do
Evaluate the EDA tool landscape and identify solutions aligned with the design roadmap across business groups.
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As the Manufacturing Digital Platforms Manager (Backend), you will lead the transformation of manufacturing systems within Nexperia’s Digital Engine. You will drive the shift from fragmented legacy environments to standardized, scalable, and AI-ready digital platforms across backend operations.
This role is responsible for translating enterprise digital strategy into execution across manufacturing, covering MES, equipment automation, factory systems, and quality platforms. You will enable integrated, data-driven capabilities that deliver measurable business value and support the transition toward an AI-native operating model.
We are looking for a Principal Package Design Engineer to support new semiconductor package development and continuous design improvement, primarily focusing on discrete packages. This role plays a key part in New Product Introduction (NPI) as well as mass production, ensuring robust, manufacturable, and cost-effective package designs. You will collaborate closely with package architects and cross-functional engineering teams to deliver high-quality assembly designs aligned with industry and internal standards.
What You Will Do
Lead and support lead frame package design for NPI and mass production phases, ensuring alignment with functional and manufacturing requirements
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As a Senior Equipment Engineer (Trim & Form), you will be responsible for driving equipment reliability, performance, and continuous improvement of trim and form operations in a high-volume semiconductor manufacturing environment. This role combines strong equipment engineering leadership with solid process and tooling knowledge to support new product introductions, yield improvement, and advanced packaging technologies. You will work closely with cross-functional teams.
Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
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We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
Develop and implement process improvements to enhance yield, reliability, and throughput.
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