- Die Attach Process Module Engineering team for Process/Materials Development, Qualification and Transfer to HVM.
15 days
Packaging Engineer Jobs in Simpang - November 2026 - Urgent Hiring
Showing 9 jobs results for
"packaging engineer"
in Simpang
- Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements.
21 days
- Key technology development & tech-staging role to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
13 days
- Lead and support advanced semiconductor research on bio-based, biodegradable, recyclable, and sustainable materials for electronic packaging applications, including SSD, Flash, and emerging storage products.
15 days
- Lead and support advanced semiconductor research on bio-based, biodegradable, recyclable, and sustainable materials for electronic packaging applications, including SSD, Flash, and emerging storage products.
23 days
- As a retail/Product Design Engineer you will work in our Mechanical Engineering group on retail packaging and product designs.
19 days
- Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.
20 days
- Leading New Product Development lot/Work-Order execution at SMT.
14 days