Determining the core aspects and success criteria for automation solutions in the area of packaging. Responsible for the technical leadership of one or more engineers in the same thematic field according to the Corporate Rules of Governance.
Responsible to develop User’s Requirement Specification (URS) and Functional Specification (FS)
Defining and accomplishing projects in the area of production process automation for packaging solutions in co-operation with internal and external suppliers.
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Define and drive the R&D and technology roadmap for SiC and GaN power semiconductor packaging
Lead development and industrialization of advanced interconnect and assembly technologies, including silver/copper sinter die attach, copper clip, DBC/AMB substrates, encapsulation and thermal management
Take new packages, materials and processes from concept through pilot line to qualified mass production
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Packaging Artwork Creation: Lead the creation, refinement, and adaptation of packaging artwork across multiple product lines, based on project requirements, creative direction, and brand guidelines.
Packaging Mock-Ups (Pack Mocks): Develop and produce packaging mock-ups to support internal reviews, sales presentations, and retailer submissions.
Final Art (FA) Preparation: Prepare production-ready final art files for factory handoff, ensuring accuracy, quality, dieline alignment, and correct file formatting.
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