Assembly Operations: Die Prep equipment, Die Attach, Wirebond machinery, Laser Marking, Trim & Form, EOL, Plating, QFN Assembly equipment, and Process Engineering tools
Test Department: Turret systems, Post Test equipment, Strip & Test machinery with Pick and Place (P&P) systems, and process equipment
Improve system performance to achieve process requirements and eliminate repetitive downs
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Minimum 2 years of Pick & Place or Tape & Reel process engineering experience, preferably in fast moving semiconductor industry. Otherwise candidates without experience are welcomed to apply as training will be provided.
Knowledge in JMP, 8D, FMEA and DOE methodologies will be advantageous.
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