Process Engineer Jobs in Seremban - June 2026 - Urgent Hiring
Showing 53 jobs results for
"process engineer"
in Seremban
Never miss any updates for Process Engineer jobs
Activate Job Alert
Job "process engineer"
in "Seremban"
Manage Alert
Chat Available
You can chat with the employer only after applying for this job.
TECHNICIAN – PLANT OPERATOR
MYR1,800 - MYR2,500 Per Month
Near Train Station
This company is close to train station
- Perform day-to-day plant operations, including equipment maintenance, service, and calibration
- Coordinate maintenance schedule of plant equipment
- Data logging on equipment operation and chemicals/consumables consumption ...
Plant Operations
Mechanical Maintenance
Skills Required
Plant Operations
Mechanical Maintenance
Equipment Troubleshooting
Safety Procedures
Process Optimization
Technical Proficiency
+4
Posted
3 days ago
Undisclosed
- Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms.
- Conduct routine process capability and performance evaluations to ensure alignment with manufacturing standards.
- Identify sources of process variation and yield loss; drive corrective and preventive actions to improve in-line practices, lot-on-hold (LOH) management, and overall process capability. ...
Posted
6 days ago
Undisclosed
- We are seeking a highly driven and technically strong Plating Process Engineer to lead sustaining and continuous enhancement initiatives across semiconductor packaging operations. This role plays a critical part in ensuring plating process stability, yield improvement, and high equipment performance to support advanced and high-volume manufacturing (HVM).
- You will work closely with cross-functional teams including Equipment Engineering, R&D, NPI, Product Design, and Reliability to ensure plating capabilities meet evolving package architecture and technology requirements.
- Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms. ...
Posted
6 days ago
Undisclosed
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
- Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs. ...
Posted
3 days ago
Undisclosed
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
- Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs. ...
Posted
2 days ago
Undisclosed
- Plan and schedule qualification activities for wafer test processes in new R&D and new package introduction projects
- Execute process and product qualifications within committed timelines
- Lead overall process integration, including IT systems, to ensure smooth end-to-end manufacturing flow ...
Posted
6 days ago
Undisclosed
- Plan and schedule qualification activities for wafer test processes in new R&D and new package introduction projects
- Execute process and product qualifications within committed timelines
- Lead overall process integration, including IT systems, to ensure smooth end-to-end manufacturing flow ...
Posted
6 days ago
Undisclosed
- To perform molding equipment maintenance, molding process and improvements which are to be attained through practical use of statistical tool methods, data extraction and analysis.
- To conduct machine life span studies and equipment maintenance cost reduction.
- Ownership on operational indicators such as safety, machine OEE,UPH, MTBA line yield and machine defect reduction. ...
Posted
18 days ago
Undisclosed
- Responsibilities
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line. ...
Posted
21 days ago
Undisclosed
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
- Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs. ...
Posted
24 days ago
Nexperia Germany GmbH
Undisclosed
- About the Role
- As a Senior Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.What You Will Do
- Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types. ...
Posted
21 days ago
Nexperia Germany Gmbh
Undisclosed
- Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines.
- Develop, implement, and improve die attach processes for semiconductor devices.
- Troubleshoot equipment and process issues to maintain high yield and reliability. ...
Posted
21 days ago
Nexperia Germany GmbH
Undisclosed
- We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this role, you will take ownership of die bond equipment, including buyoff machines, and processes to ensure high-quality, reliable, and efficient production. You will collaborate with R&D, manufacturing, and process teams to support new product introductions, troubleshoot equipment issues, and drive continuous process improvements.
- What You Will Do:
- Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines. ...
Posted
21 days ago
Nexperia Germany Gmbh
Undisclosed
- Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
- Develop and implement process improvements to enhance yield, reliability, and throughput.
- Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment. ...
Posted
21 days ago
Nexperia Germany GmbH
Undisclosed
- We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
- Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
- Develop and implement process improvements to enhance yield, reliability, and throughput. ...
Posted
21 days ago
Undisclosed
- Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
- Develop and implement process improvements to enhance yield, reliability, and throughput.
- Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment. ...
Posted
21 days ago
Undisclosed
- BG Partnership: Serve as the primary strategic partner to Business Groups (BG) during the product architectural phase to ensure Design for Excellence (DFX) and seamless technology transfer.
- Operational Readiness: Direct the team in executing complex qualifications, ensuring all products meet the "Gold Standard" of being Capable, Stable, and Manufacturable ($C_{pk} \geq 1.67$, zero-defect reliability, and optimized OEE).
- Handshake Governance: Define and enforce the global "Handshake" protocols between R&D and Operations to eliminate friction during mass production ramps. ...
Posted
6 days ago
Undisclosed
- About The Role
- The Director of CPE & NPI is a high-impact leadership role responsible for the end-to-end industrialization strategy of Assembly and Final Test (FT) technologies. This individual will lead a multidisciplinary organization of ~50 personnel, overseeing the seamless transition of new products from concept to high-volume manufacturing (HVM) while aggressively optimizing the Value Added (MVA) through strategic BOM engineering.
- What You Will Do ...
Posted
6 days ago
Undisclosed
- Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma
- Drive end-to-end process development from concept to stable, high-yield manufacturing solutions
- Provide technical input for assembly processes and equipment solutions for new products and platforms ...
Posted
21 days ago
Undisclosed
- As a Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.
- What You Will Do
- Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma ...
Posted
21 days ago
Undisclosed
- Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma
- Drive end-to-end process development from concept to stable, high-yield manufacturing solutions
- Provide technical input for assembly processes and equipment solutions for new products and platforms ...
Posted
a month ago
Undisclosed
- Support the development and execution of experiments to create new technology platforms
- Work with the East Fishkill Post FAB team in New York and cross functional teams on global basis to implement processes into manufacturing
- Enhance technical skills in 300mm wafer thinning, metal deposition, materials, and packaging ...
Posted
3 days ago
Undisclosed
- Supports and assesses existing processes and workflows.
- Designs and implements basic engineering projects: process development, process design.
- Troubleshoot process development issues and interacts with mechanical, electrical and software engineers to resolve issues and fix bugs. ...
Posted
5 days ago
Browse Company:
Browse "process engineer" Job By:
Browse "process engineer" Job By: