Lead and ensure smooth daily manufacturing operations, promptly resolving complex issues to minimize downtime and maintain production efficiency in respective module.
Process Ownership & Support Own and support assigned manufacturing processes. Monitor process performance, yield, quality, and productivity metrics. Provide daily technical support to manufacturing operations.
Lead or participate in metallurgical and materials engineering projects involving micro-alloyed castings, mechanical deformation, thermo-mechanical treatment, and bonding wire coating processes
Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
Operate and perform stages of chemical manufacturing activities, forklift and stacker activities in accordance to work instructions and safety standards.