Lead process development activities for Die Attach technologies, including process parameter scouting, optimization, verification, qualification, and process freeze to meet project objectives in quality, cost, manufacturability, and timeline.
Assess the existing end-to-end substrate workflow, from design inputs and planning through layout, verification, documentation, and manufacturing release.
Wafer-Level Test Process Ownership: Own and continuously improve wafer-level test processes to ensure stable, repeatable, and efficient production execution. Lead the setup, qualification, and day-to-day operation of automated wafer probers, optical alignment systems, and Automated Test Equipment (ATE) for electrical and photonic wafer-level testing.
Metrology owner of CNC smarts cope, and other contact/non-contact profilers, covering from recipe setup, inspection execution, and data analysis on products of micro optics, and/or;
Enter data and maintain QC records, inspection reports, and test results in the company’s database or filing system to ensure accurate quality tracking
To interface with clients providing technical advice on all aspects of power plant development including configuration options, prime equipment selection, BoP systems & components, enabling infrastructure and considerations for project implementation.