Responsible for the Underfill (UF) process for flip-chip die-level assembly.
Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.
Maintain assembly yield and assembly test yield related to the Underfill process in line with department targets and KPIs, including lot bracketing and disposition.
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Own and support the Flip Chip Attach (FCA) process to achieve quality, yield, cost, reliability, and productivity targets.
Provide technical support to Advanced Process Engineering in delivering process and equipment solutions that meet operational and development requirements.
Monitor and maintain assembly yield and test yield performance related to the FCA process in alignment with departmental KPIs.
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Factory Capex planning base on the loading forecast, Capex budget control and monitoring on capital utilization and efficiency.
Productivity improvement project: Lead in cost saving projects such as Productivity improvement, cycle time improvement, MMR improvement, etc. to meet company goals.
Capacity planning and analysis to meet the volume demand and maximize the plant utilization.
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