Excursion Management: Lead excursion issue, collaborate with all cross functional team and follow up on issue/excursion closure. Perform line audit to ensure production line compliances.
Yield Management: Oversee overall yield management for specific products, covering both assembly and test processes to ensure optimal performance and quality.
Commonality Analysis: Coordinate cross-functional teams to perform commonality analysis by product design, process, machine, material, and measurement to identify root causes of issues and develop effective improvement plans.
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AIXTRON SE in Batu Kawan, Malaysia seeks a customer-focused specialist with strong MOCVD experience to support clients globally. You will implement process recipes, coordinate evaluations, and analyze data to improve equipment performance.
On-site and long-term international travel are expected while maintaining excellent English communication. Advanced degree in physics, electrical engineering or materials science is preferred, with experience in III/V or related semiconductors.
Serve as the Package Engineering representative on cross functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
Provide end to end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross functional engineering teams, global factories, and key stakeholders.
Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost effective high volume introduction of new package designs and advanced assembly processes.
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