Process Technician Jobs in Seremban - June 2026 - Urgent Hiring
search.result_querys_job
"process technician"
text.in Seremban
job_alert.title_toggle_job
job_alert.activate_job_alert
job_alert.job "process technician"
job_alert.in "Seremban"
job_alert.btn_manage_alert
Boleh Sembang
Anda hanya boleh sembang dengan majikan selepas memohon kerja ini.
TECHNICIAN – PLANT OPERATOR
MYR1,800 - MYR2,500 Sebulan
Dekat Stesen Tren
Syarikat ini berdekatan dengan stesen tren
- Perform day-to-day plant operations, including equipment maintenance, service, and calibration
- Coordinate maintenance schedule of plant equipment
- Data logging on equipment operation and chemicals/consumables consumption ...
Plant Operations
Mechanical Maintenance
Kemahiran Diperlukan
Plant Operations
Mechanical Maintenance
Equipment Troubleshooting
Safety Procedures
Process Optimization
Technical Proficiency
+4
Posted
10 hours ago
Undisclosed
- To perform molding equipment maintenance, molding process and improvements which are to be attained through practical use of statistical tool methods, data extraction and analysis.
- To conduct machine life span studies and equipment maintenance cost reduction.
- Ownership on operational indicators such as safety, machine OEE,UPH, MTBA line yield and machine defect reduction. ...
Posted
a day ago
Undisclosed
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
- Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs. ...
Posted
7 days ago
Undisclosed
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
- Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs. ...
Posted
8 days ago
Undisclosed
- Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms.
- Conduct routine process capability and performance evaluations to ensure alignment with manufacturing standards.
- Identify sources of process variation and yield loss; drive corrective and preventive actions to improve in-line practices, lot-on-hold (LOH) management, and overall process capability. ...
Posted
11 days ago
Undisclosed
- We are seeking a highly driven and technically strong Plating Process Engineer to lead sustaining and continuous enhancement initiatives across semiconductor packaging operations. This role plays a critical part in ensuring plating process stability, yield improvement, and high equipment performance to support advanced and high-volume manufacturing (HVM).
- You will work closely with cross-functional teams including Equipment Engineering, R&D, NPI, Product Design, and Reliability to ensure plating capabilities meet evolving package architecture and technology requirements.
- Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms. ...
Posted
11 days ago
Undisclosed
- Plan and schedule qualification activities for wafer test processes in new R&D and new package introduction projects
- Execute process and product qualifications within committed timelines
- Lead overall process integration, including IT systems, to ensure smooth end-to-end manufacturing flow ...
Posted
11 days ago
Undisclosed
- Plan and schedule qualification activities for wafer test processes in new R&D and new package introduction projects
- Execute process and product qualifications within committed timelines
- Lead overall process integration, including IT systems, to ensure smooth end-to-end manufacturing flow ...
Posted
11 days ago
Undisclosed
- Process Optimization:
- Analyze and optimize adhesive manufacturing processes to enhance efficiency, reduce waste, and improve overall productivity.
- Identify opportunities for continuous improvement and implement innovative solutions. ...
Posted
a month ago
Undisclosed
- Process Optimization:
- Analyze and optimize adhesive manufacturing processes to enhance efficiency, reduce waste, and improve overall productivity.
- Identify opportunities for continuous improvement and implement innovative solutions. ...
Posted
a month ago
Undisclosed
- BG Partnership: Serve as the primary strategic partner to Business Groups (BG) during the product architectural phase to ensure Design for Excellence (DFX) and seamless technology transfer.
- Operational Readiness: Direct the team in executing complex qualifications, ensuring all products meet the "Gold Standard" of being Capable, Stable, and Manufacturable ($C_{pk} \geq 1.67$, zero-defect reliability, and optimized OEE).
- Handshake Governance: Define and enforce the global "Handshake" protocols between R&D and Operations to eliminate friction during mass production ramps. ...
Posted
11 days ago
Undisclosed
- About The Role
- The Director of CPE & NPI is a high-impact leadership role responsible for the end-to-end industrialization strategy of Assembly and Final Test (FT) technologies. This individual will lead a multidisciplinary organization of ~50 personnel, overseeing the seamless transition of new products from concept to high-volume manufacturing (HVM) while aggressively optimizing the Value Added (MVA) through strategic BOM engineering.
- What You Will Do ...
Posted
11 days ago
Undisclosed
- To perform molding equipment maintenance, molding process and improvements which are to be attained through practical use of statistical tool methods, data extraction and analysis.
- To conduct machine life span studies and equipment maintenance cost reduction.
- Ownership on operational indicators such as safety, machine OEE,UPH, MTBA line yield and machine defect reduction. ...
Posted
23 days ago
Undisclosed
- Responsibilities
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line. ...
Posted
a month ago
Undisclosed
- Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
- CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
- Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs. ...
Posted
a month ago
Nexperia Germany GmbH
Undisclosed
- About the Role
- As a Senior Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.What You Will Do
- Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types. ...
Posted
a month ago
Nexperia Germany Gmbh
Undisclosed
- Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines.
- Develop, implement, and improve die attach processes for semiconductor devices.
- Troubleshoot equipment and process issues to maintain high yield and reliability. ...
Posted
a month ago
Nexperia Germany GmbH
Undisclosed
- We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this role, you will take ownership of die bond equipment, including buyoff machines, and processes to ensure high-quality, reliable, and efficient production. You will collaborate with R&D, manufacturing, and process teams to support new product introductions, troubleshoot equipment issues, and drive continuous process improvements.
- What You Will Do:
- Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines. ...
Posted
a month ago
Nexperia Germany Gmbh
Undisclosed
- Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
- Develop and implement process improvements to enhance yield, reliability, and throughput.
- Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment. ...
Posted
a month ago
Nexperia Germany GmbH
Undisclosed
- We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
- Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
- Develop and implement process improvements to enhance yield, reliability, and throughput. ...
Posted
a month ago
Undisclosed
- Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
- Develop and implement process improvements to enhance yield, reliability, and throughput.
- Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment. ...
Posted
a month ago
Undisclosed
- Using key metrics and your own fab knowledge, you monitor the health of the Fab and redirect priorities as needed. You must become an expert at interpreting these metrics.
- Escalate Safety observations to appropriate stakeholders for resolution. Ensure that issues are followed through to closure.
- Identify and escalate production impactors to ensure the even and efficient flow of our production line. ...
Posted
a day ago
Undisclosed
- Using key metrics and your own fab knowledge, you monitor the health of the Fab and redirect priorities as needed. You must become an expert at interpreting these metrics.
- Escalate Safety observations to appropriate stakeholders for resolution. Ensure that issues are followed through to closure.
- Identify and escalate production impactors to ensure the even and efficient flow of our production line. ...
Posted
22 days ago
Undisclosed
- Have clear understanding about semiconductor manufacturing assembly and test basic requirement to production line such as ESD/5S/C.C. S and follow these requirements strictly and find out problems to report to production technicians in time.
- Operate equipment or work in other positions according to the specification and/or working instruction to pursue the work correctly.
- Comply with IATF16949 & EHS requirement base on IATF16949 & EHS manual and specification. ...
Posted
7 days ago
Undisclosed
- Define and drive equipment strategies aligned with factory and package R&D roadmaps
- Evaluate and select new equipment technologies for manufacturing processes
- Lead equipment introduction and qualification projects ...
Posted
12 days ago
Undisclosed
- As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre-Assembly, Die Bond, Wire Bond, Mold, and related areas.
- This role requires strong technical expertise, project leadership, and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.What You Will Do
- Equipment & Technology Strategy ...
Posted
12 days ago
Undisclosed
- Have clear understanding about semiconductor manufacturing assembly and test basic requirement to production line such as ESD/5S/C.C. S and follow these requirements strictly and find out problems to report to production technicians in time.
- Operate equipment or work in other positions according to the specification and/or working instruction to pursue the work correctly.
- Comply with IATF16949 & EHS requirement base on IATF16949 & EHS manual and specification. ...
Posted
a month ago
Undisclosed
- Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
- Own molding process performance, yield, and equipment stability in production.
- Provide technical leadership and guidance on molding-related topics within cross functional teams. ...
Posted
11 days ago
Undisclosed
- Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
- Own molding process performance, yield, and equipment stability in production.
- Provide technical leadership and guidance on molding-related topics within cross functional teams. ...
Posted
11 days ago
Undisclosed
- New Package Technology and New Platform Module Development
- Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
- Good understanding of MRS and generate PRS with SCD definition. ...
Posted
15 days ago
job_search.browse_company:
job_search.browse_job_by_title:
job_search.browse_job_by_title: