The trainee will undergo a structured 6-month on-the-job training programme within the Wet Process Engineering team in a 300mm semiconductor wafer fabrication facility. Designed for fresh Polytechnic graduates, the programme provides foundational exposure to semiconductor manufacturing, wet cleaning and wet etching processes, statistical process control (SPC), manufacturing data analysis, and process improvement methodologies. Under the guidance of experienced engineers, the trainee will develop technical competencies required for an Associate Engineer role while supporting daily manufacturing operations and continuous improvement initiatives.
MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.
Perform process sustaining tasks on 12-hours shifts (morning & night) such as holding lots dispositions, shift pass-down, alarm recovery, tool set-up data review, SPC/FDC/YDD out-of-control inhibits and checking, data analysis and compilation, and tasks claim as assigned by supervisors.
Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
Perform engineering analysis to identify optimal solutions based on client drivers and be able to efficiently communicate these solutions through technical reports and presentations
Conduct real time problem analysis: Equipment Alarms/failure, alarms, LOH, SPC OOC/OOS, Defect failure, and FDC failure & determine solutions through liaising with all parties involved & through studying past cases.
Lead and ensure smooth daily manufacturing operations, promptly resolving complex issues to minimize downtime and maintain production efficiency in respective module.
Lead and ensure smooth daily manufacturing operations, promptly resolving complex issues to minimize downtime and maintain production efficiency in respective module.