Ownership of Assembly & Fab yields & quality improvement projects, cost reduction for power semiconductor products (technology as assigned and assembled primarily in Malaysia manufacturing plant, but not limited to), including electrical specification per datasheet and quality performance to meet/exceed product quality & reliability standards and customer expectations
Work with internal and external customers on product quality improvement & zero-defect goals
Work with Business Units, Operations (Assembly & Fabs), Test Engineering, Packaging R&D and Quality teams to identify opportunities for cost reduction, yield/quality improvements and defect reduction
...
Infineon Technologies AG in Melaka invites a Principal Engineer to shape the future of test engineering for power semiconductors. You will develop innovative test methods, design test hardware for front-end wafer test and back-end final testing, and transfer packages to production sites worldwide.
The role requires a Bachelor's in E&E, 5 years in high voltage IPM or gate driver IC, 2+ years in wide-bandgap test development, and strong C/C++ skills.
Lead the development, deployment, and sustenance of a standardized Test Package & Program Management System, supporting the product lifecycle from NPI to High Volume Manufacturing across Frontend and Backend manufacturing sites
Ownership & responsible to drive the harmonization, governance, and continuous improvement of test package/program verification, buyoff, and release processes through standardized methodologies, best practices, and digital solutions
Collaborate closely with Product Engineering, Test Engineering, Manufacturing Sites, and Development Teams to establish Best Known Methods (BKMs), drive cross-site process optimization, and facilitate technical knowledge sharing
...