- Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
- Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
- Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
- Establish close partnership with Product Engineers to provide solutions on suspected test issue among the list of identified fallout pareto that result in lower than expected CWATY/CWASY yield.
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