WD thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Conduct inspection on returned FG (Media, Bag, Carton, or Pallet) and ad-hoc impacted FG, with accurate disposition and documentation per quality standards.
Perform Out-of-Box (OBA) Audits on FG to verify packaging integrity, labeling, and product conformance prior to shipment.
Execute FG Archive activities per established retention and traceability procedures.
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Participate in Non-conformance issue part containment and disposition discussion, and execution during quality incident.
Responsible for review and approval of discrepant lot disposition in eNCS. Hold authority to reject in the system if it does not meet release requirements.
Lead Material Review Board (MRB) for Part Containment and Disposition.
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Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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Machinery & Equipment: Support multi-discipline manufacturing processes with respect to the repair, maintenance, installation and/or enhancement of a select group of machinery and equipment or interrelated systems.
Process/Product/Production: Provides technical support in the area of electronic or mechanical operations, tests, experiments and/or problem resolution associated with components, parts, products or processes/systems.
Test & Repair: Tests and calibrates and/or repairs and monitors and/or installs and diagnoses equipment, systems, and/or assemblies. Works from guidelines and standardized procedures/instructions. May design/build tools.
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Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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