As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.
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Support to integrate classical machine learning with Generative AI to support process applications such as anomaly detection, predictive maintenance, yield optimization and etc.
Assist in building and development of NLP (Natural Language Processing) pipelines from SMT/ Mechanical Assembly process engineering critical KPOV data manipulation (eg. SMT machine performance report, Mechanical assembly measurement output)
Handling unstructured engineering data such as equipment logs, FA reports, and production records, suitable for NLP-based automation (classification, summarization, insights extraction).
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Support to integrate classical machine learning with Generative AI to support process applications such as anomaly detection, predictive maintenance, yield optimization and etc.
Assist in building and development of NLP (Natural Language Processing) pipelines from SMT/ Mechanical Assembly process engineering critical KPOV data manipulation (eg. SMT machine performance report, Mechanical assembly measurement output)
Handling unstructured engineering data such as equipment logs, FA reports, and production records, suitable for NLP-based automation (classification, summarization, insights extraction).
...