Equipment Engineering Trainee (Chemical Mechanical Planarization - CMP) - GRIT Traineeship
- The trainee will undergo a structured 6-month on-the-job training programme within the CMP Equipment Engineering team in a 300mm semiconductor wafer fabrication facility. The programme aims to develop practical knowledge and hands-on competencies in semiconductor equipment maintenance, equipment troubleshooting, preventive maintenance, spare parts management, and equipment performance monitoring. Under the guidance of experienced engineers, the trainee will support day-to-day equipment operations while developing the technical foundation required for an Equipment Associate Engineer role.
23 days