Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality.
Develop new automated die attach programs, optimize process parameters, and recipe standardization.
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Responsible for development, qualification, and high-volume production transfer of new processes, materials, and manufacturing technologies.
Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and process leadership.
Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
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Responsible for the circuit design, simulation, and verification of key analog/mixed-signal modules for 3D-NAND memory, including but not limited to: 1) Row/Column Decoder design and optimization. 2) Charge PUMP architecture design to meet multi-voltage domain, high efficiency, and low noise requirements. 3) Sense Amplifier circuit development, balancing speed, power consumption, and read accuracy. 4) High-voltage switch (HV Switch) and level shifter design to support >20V high-voltage operation. 5) I/O interface circuitry (including ESD protection, drive capability matching, and signal integrity optimization).
Establish and maintain Verilog-A behavioral models of key modules for rapid system-level simulation and verification;
Perform array-level mixed-mode simulation, proficient in using tools such as SPICE, Spectre, and HSPICE, and combining Verilog/Verilog-AMS for large-scale circuit verification;
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