Full responsibility of equipment performance uptime. Define maintenance procedures and perform equipment maintenance to keep up and sustain machine basic condition.
The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics.
Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
Define, develop, prove out, and deploy manufacturing processes for new products across the transceiver assembly flow (e.g., die attach, wire bond, active alignment, and general assembly), implementing continuous improvement projects to achieve yield, throughput, efficiency, scrap, and quality targets.
Apply engineering principles and process engineering techniques to develop, optimize, and improve manufacturing processes in a semiconductor production environment.
Job ComplexityProficient in some aspects of a technical discipline.Initiative and creativity are limited to fulfilling standard practices related to job responsibilities.Uses standard engineering methods to analyze and resolve problemsAccountabilityCompletes a variety of routine projects, assignments and tasks.Participates in teamsRelationship FocusDirected contact at engineering level.Knowledge, Skills & AbilitiesBasic principles and practices in one technical discipline.Requires a technical (University) degree. (Exceptions approved by local HR)BS + 0-2 years of experience orMS + 0-2 years