Lead complex failure investigations and RCCA activities involving power semiconductor devices, including Si, SiC, GaN, MOSFETs, IGBTs, diodes and power modules.
Domain Authority: Serve as the semiconductor domain expert for the Eureka Materials Agent, ensuring technical accuracy and industrial practicability for chip, device, and material reverse engineering scenarios.
The trainee will undergo a structured 6-month on-the-job training programme within the CMP Equipment Engineering team in a 300mm semiconductor wafer fabrication facility. The programme aims to develop practical knowledge and hands-on competencies in semiconductor equipment maintenance, equipment troubleshooting, preventive maintenance, spare parts management, and equipment performance monitoring. Under the guidance of experienced engineers, the trainee will support day-to-day equipment operations while developing the technical foundation required for an Equipment Associate Engineer role.
As an NPI Engineer, you will play a pivotal role in driving the successful introduction of new products from concept development through to mass production.
Develop and debug ATE test programs for Digital, PMIC, RF, and Mixed-Signal semiconductor products using Advantest V93000 (SmartTest 7/8) and/or Teradyne UFLEX platforms.
Develop and debug ATE test programs for Digital, PMIC, RF, and Mixed-Signal semiconductor products using Advantest V93000 (SmartTest 7/8) and/or Teradyne UFLEX platforms.
Collaborate with customers and internal teams to understand process requirements, support technology roadmaps, and provide technical solutions that enhance semiconductor manufacturing performance.