Own and improve manufacturing process performance for Ti-Etch, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
Own and improve manufacturing process performance for Ti-Etch, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
Wafer-Level Test Process Ownership: Own and continuously improve wafer-level test processes to ensure stable, repeatable, and efficient production execution. Lead the setup, qualification, and day-to-day operation of automated wafer probers, optical alignment systems, and Automated Test Equipment (ATE) for electrical and photonic wafer-level testing.