Apply through LinkedIn or send us your profile, résumé, and examples of systems or technical initiatives you have led. We would especially like to hear about the complexity involved, your individual contribution, the decisions you made, and the resulting impact.
Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
Lead collaborative efforts within the team to develop detailed design models and simulations for mechanical and HVAC systems in data center projects, utilizing advanced modeling techniques and industry best practices.
Working and interacting with a wide variety of NI staff and NI Alliance partners in semiconductor test engineering, test program structure, hardware design, and fixture design in support of customer solutions.
Act as a role model for the Project team member(s) for ESG and T.EN values and contribute to T.EN’s purpose of breaking boundaries to engineer a sustainable future.
Client & Requirement Analysis: Work with clients to understand their business and technical requirements and translate them into practical cloud-based solutions.
He/She reports directly to the Piping Stress Lead (on Projects he/she is assigned to) for all stress activities on a project for all tasks pertaining to adequacy of pipe stress and flexibility analysis, and related piping design activities, and administration matters.
Core Development: Responsible for feature development and architecture optimization of the MPC Wallet Android client, ensuring code quality and maintainability.