Project lead for new equipment or improvement action.
Follows up on LOH improvement actions, monitor effectiveness & close loop to MEEQ teams.
Continuously identify the equipment risks and update using EFMEA. Escalate issues detected, developing reject trends and close the EFMEA action as planed.
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Sr Engineer Factory Automation is part of central factory automation group of Nexperia ATSN. You will be responsible for improving & maintaining connectivity and automation for the factory. You would also contribute to smart manufacturing roadmap in implementing AI operator, Image AI solutions, AI controller selection and implementation for turning the factory in to a centrally controlled smart factory.
What You Need To Do:KEY RESPONSIBILITIES
· Build automation solution involving AI controller, connectivity improvement, SW driven automation of line/ process
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Sr Engineer Factory Hardware Automation is part of central factory automation group of Nexperia ATSN. You will be responsible for improving & maintaining connectivity and automation for the factory. You would also contribute to smart manufacturing roadmap in implementing AI operator, Image AI solutions, AI controller selection and implementation for turning the factory in to a centrally controlled smart factory.
What You Need To Do:KEY RESPONSIBILITIES
· Build automation solution involving AI controller, connectivity improvement, SW driven automation of line/ process
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...
Project lead for new equipment or improvement action.
Follows up on LOH improvement actions, monitor effectiveness & close loop to MEEQ teams.
Continuously identify the equipment risks and update using EFMEA. Escalate issues detected, developing reject trends and close the EFMEA action as planed.
...
Project lead for new equipment or improvement action.
Follows up on LOH improvement actions, monitor effectiveness & close loop to MEEQ teams.
Continuously identify the equipment risks and update using EFMEA. Escalate issues detected, developing reject trends and close the EFMEA action as planed.
...
System owner for Facilities Mechanical System including HVAC, Compressed Dry Air, Vacuum, Process Cooling, Exhaust and Cleanroom.
Provide technical guidance to manufacturing, safety and project team on mechanical system capabilities, concern and troubleshooting.
Act as project coordinator for replacement, upgrading, expansion or modification of buildings, utilities and services within the wafer fab related to mechanical system.
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To comply and adhere to all matters pertaining to Quality, Safety & Health and Environment related to the job scope and work place as required by the Company.
Any other duties that will be assigned from time to time by the Management.
In this role, you will be the core technical driver of the project's scheduling framework, leading the development, optimisation, and day-to-day management of the master schedule to ensure the successful delivery of a complex, fast-paced, large-scale data center project. The ideal candidate will possess advanced mastery in Primavera P6, a deep understanding of fast-track construction sequencing, and specialised knowledge of data center infrastructure.
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...
Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...
Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...