We are looking for a technology development engineer who will be driving innovations on technology, device and system level, shaping the next generations of High-Voltage Power Devices as part of a global development team
Develop new voltages classes and broadening the functionality of the existing products
Support the ramp up and yield learning phase of new technology platforms like CoolSiC or JFET together with the process integration group
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Develop and lead key wafer function test hardware solutions, including tester-to-prober interfaces, probe interface boards, probe cards, docking hardware, and test head handling concepts
Translate product, equipment, and manufacturing requirements into robust hardware concepts that support different device technologies, tester platforms, prober models, and production environments
Contribute to the definition, refinement, and standardization of prober docking solutions for broader usage, with focus on repeatability, planarity control, alignment accuracy, maintainability, safety, and ease of setup
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Develop and lead key wafer function test hardware solutions, including tester-to-prober interfaces, probe interface boards, probe cards, docking hardware, and test head handling concepts
Translate product, equipment, and manufacturing requirements into robust hardware concepts that support different device technologies, tester platforms, prober models, and production environments
Contribute to the definition, refinement, and standardization of prober docking solutions for broader usage, with focus on repeatability, planarity control, alignment accuracy, maintainability, safety, and ease of setup
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Develop Si Power MOSFET wafer technologies and product features to realize new powerdevices that meet the performance, cost, and quality targets.
Drive experiments from the process split definition to the realization in the clean room, analyze available in-line metrology and electrical test data.
Ensure process stability, quality of the manufacturing route for the mass-production release.
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Perform electrical failure analysis, identifying and researching component failures to support Intel factory reject. Your responsibilities will include but not be limited to:
Perform electrical validation and fault isolation using analytical tools such as Parametric Analyzer (I/V analysis), Keithley meter, iTDR, EOTPR, CTMB/ SBTS, micro-probing, SEM/EDX, IRLC etc.
Perform CSAM (C-mode Scanning Acoustic Microscopy) to detect defect.
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Develop, qualify, and optimize wafer fabrication processes for Insulated Gate Bipolar Transistor (IGBT) technologies to support high-reliability power semiconductor applications in industrial and energy systems.
Establish and improve process flows, materials, and methodologies to meet product performance, quality, and cost targets in line with Fuji Electric manufacturing standards.
Demonstrate strong support of wafer process integration, including key modules such as oxidation, lithography, ion implantation, diffusion, etching, thin film deposition, and metallization, with focus on IGBT device characteristics.
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