Understand and operate test lab equipment (prober, probe card analyzer, test benches, etc.) required for probe card characterization and optical inspection.
Define FA flow and execute detailed electrical and physical failure analysis for memory device, package, qualification, RMA, and technology-development failures.
Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target
Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target
Understand and operate test lab equipment (prober, probe card analyzer, test benches, etc.) required for probe card characterization and optical inspection.