Responsible for maintaining, optimizing, and developing the backend testing and handling processes for semiconductor products mounted on leadframes or strips using Cohu SH5300A (Strip handler) and FH1200 (Film Frame handler).
Focus on yield improvement, equipment reliability, and defect reduction during the testing.
...
Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...
Responsible for maintaining, optimizing, and developing the backend testing and handling processes for semiconductor products mounted on leadframes or strips using Cohu SH5300A (Strip handler) and FH1200 (Film Frame handler).
Focus on yield improvement, equipment reliability, and defect reduction during the testing.
...
Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...
Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...
Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
...