Kerja Sepenuh Masa, Clip Bond Engineer di AIC Semiconductor Kedah - Maukerja

Job Functions:
The Clip Bond Engineer is responsible for developing, optimizing, and sustaining clip bonding processes used in semiconductor packaging. This role focuses on ensuring high-quality interconnections, improving yield, and supporting production through process control, troubleshooting, and continuous improvement.

Key Responsibilities:

• Develop, optimize, and maintain clip bonding processes for semiconductor packages

• Set up, qualify, and troubleshoot clip bonding equipment and materials

• Monitor process performance, yield, and reliability; implement corrective actions

• Conduct DOE, root cause analysis, and failure analysis for bonding-related issues

• Support new product introduction (NPI), process transfer, and mass production

• Collaborate with cross-functional teams (R&D, Quality, Production, Suppliers)

• Prepare process documentation, SOPs, and technical reports

• Ensure compliance with quality, safety, and industry standards

Requirements / Qualifications:

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field)

• Experience in semiconductor packaging or assembly (clip bond, wire bond, die attach preferred)

• Knowledge of bonding materials, equipment, and reliability testing

• Strong analytical and problem-solving skills

• Familiar with SPC, DOE, FMEA, and quality tools

• Good communication skills and ability to work in a team