Kerja Sepenuh Masa Process - Equipment Technician (Sawing), Gaji tinggi MYR 4,200 di Globetronics Pulau Pinang - Maukerja

Job Title: Process & Equipment Technician (Sawing)

Location: Penang, Malaysia

Job Summary

Responsible for supporting semiconductor sawing operations by ensuring equipment performance, process stability, product quality, and production efficiency. The technician will perform machine setup, troubleshooting, preventive maintenance, and process monitoring for wafer sawing and singulation processes.

Key Responsibilities

• Set up, operate, and monitor wafer sawing equipment according to production requirements.
• Perform routine machine troubleshooting and corrective maintenance to minimize downtime.
• Execute preventive maintenance (PM) and equipment calibration activities.
• Monitor critical process parameters and ensure compliance with quality standards.
• Support process improvement activities to enhance yield, quality, and productivity.
• Perform machine qualification and verification after maintenance or process changes.
• Analyze equipment and process issues, identify root causes, and implement corrective actions.
• Maintain equipment logs, maintenance records, and process documentation.
• Ensure compliance with EHS, ESD, and company quality requirements.
• Support engineering teams in process evaluations and continuous improvement projects.

Requirements

• Diploma, Certificate, or Technical qualification in Electronics, Electrical, Mechanical, Mechatronics Engineering, or related disciplines.
• Minimum 1–3 years of experience in semiconductor manufacturing.
• Hands-on experience in wafer sawing, wafer singulation, or back-end semiconductor processes.
• Familiarity with sawing equipment operation, blade management, alignment, and process control.
• Knowledge of mechanical, electrical, pneumatic, and vacuum systems troubleshooting.
• Ability to work independently and in a fast-paced manufacturing environment.
• Willingness to work on rotating shifts.

Preferred Skills

• Experience with sawing equipment such as DISCO, ADT, or equivalent wafer singulation systems.
• Understanding of SPC, 5S, Lean Manufacturing, and problem-solving methodologies.
• Basic knowledge of semiconductor assembly and test processes.
• Good analytical and communication skills.

Key Selling Points

• Opportunity to work with advanced semiconductor manufacturing technologies.
• Career advancement and skill development opportunities.
• Comprehensive training and technical exposure.

Job Type: Full-time

Pay: RM2,800.00 - RM4,200.00 per month

Benefits:

• Additional leave
• Cell phone reimbursement
• Company car
• Dental insurance
• Flexible schedule
• Free parking
• Health insurance
• Maternity leave
• Opportunities for promotion
• Parental leave
• Professional development

Work Location: In person