Kerja Sepenuh Masa, Package Design Engineer di Infinecs Pulau Pinang - Maukerja

Design and develop lead-frame and substrate laminate packages Perform package layout design, lead-frame drafting, and wire bonding scheme development Collaborate closely with suppliers and cross-functional engineering teams Deliver manufacturable, high-quality package designs using industry-standard CAD tools Maintain accurate design documentation and reporting

Minimum 5 years of experience in package design engineering. Proven experience in lead-frame and/or substrate laminate package design Hands-on experience in package layout design, lead-frame drafting, and wire bonding schemes Proficiency in AutoCAD for lead-frame design and drafting Experience with Cadence tools for substrate laminate package design Experience working with lead-frame and/or substrate suppliers Strong communication, collaboration, and documentation skills Familiarity with emerging semiconductor packaging technologies is an advantage