Kerja Sepenuh Masa, Associate Equipment Engineer (Grinding-Dicing-LLO-Bonding) di OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang Kedah - Maukerja

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on *************

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Your new responsibilities

• To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
• Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
• Carry out calibration/ preventive maintenance to the machine and equipment.
• Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
• Performs other project related to improve production operation. Assist process engineer to carry out evaluation
• Document production equipment and assembly work instruction to hand off from Engineering to Operations

What we look for

• Min. Diploma or equivalent qualification in engineering.
• Min 5 years experience in manufacturing environment and maintenance engineering.
• Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
• Able to communicate in English and Bahasa Malaysia.

Please contact Shin Yih Cheah for further information via *************.