- Kepala Batas, Penang Kepala Batas Kedah Malaysia

Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Job Responsibilities:
- Monitor, baseline, and stabilize daily wafer fabrication engineering parameters (including crystal growth, wire slicing, grinding, and CMP polishing).
- Perform rigorous root-cause analysis (RCA) on yield excursions, wafer breakages, or surface defect anomalies using 8D and FMEA frameworks.
- Draft, establish, and continuously audit standard operating procedures (SOPs), process control plans, and electronic routing logs.
- Partner tightly with the Equipment Engineering team to perform process buy-off, validation loops, and recipe calibration after hardware preventive maintenance (PM).
- Coordinate directly with OEM vendors and technical experts during tool hook-up, hardware tuning, and new product qualification runs.
- Utilize Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies to consistently eliminate process variations and reduce production costs.
Job Requirements:
- Bachelor’s Degree or above in Material Science, Chemical Engineering, Applied Physics, Electronic/Electrical Engineering, or related engineering fields.
- CGPA of 3.00 and above.
- Open to fresh graduates. Prior 3-6 months internship experience in a wafer fab environment (Intel, Micron, Infineon, etc.) is a major plus.
- Must be fluent in English.
Peringatan Penting
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