Kerja Sepenuh Masa, Physical FA engineer di Accion Labs Pulau Pinang - Maukerja

Physical FA engineer 

Job Description:

The Physical Failure Analysis (PFA) Engineer is responsible for performing failure analysis on semiconductor devices, SSD products, NAND flash, ASICs, and package assemblies to identify defect mechanisms, determine root causes, and drive corrective actions

Key Responsibilities 

Perform non-destructive and destructive physical failure analysis on semiconductor devices, PCBA and SSD products.

Execute FA technique such as Cross Section, Dye-and-Pull test, Xray inspection, SEM-EDX, IC decapsulation, TDR probing & etc.

Majorly Analyse physical defects such as: Solder cracks, PCB defect, Die cracks, Delamination, EOS/ESD damage, Package and assembly-related failures.

Conduct root cause investigation and defect isolation on reliability, qualification, manufacturing, and customer-return failures.

Utilize SEM imaging to analyze device structures, interfaces, and failure mechanisms.

Support chip structure optimization through detailed FA results and recommendations.

Evaluate package reliability and robustness in response to fab process changes.

Support package evaluation and qualification for NAND and ASIC technologies.

Develop and maintain package recipe and process baselines based on FA findings.

Identify and resolve structural and packaging-related reliability issues.

Provide FA insights to influence package and product design decisions.

Qualifications

REQUIRED:

Bachelor’s degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related disciplines.

More than 1 years experience in semiconductor or PCBA failure analysis.

Solid experience in physical failure analysis (PFA) of semiconductor devices.

Strong understanding of device structures, packaging architectures, and failure mechanisms.

Good English communication skills, both written and spoken.