- Johor Bahru Johor Malaysia
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Job Description
1. Responsible for process optimization on the server motherboard DIP production line; handling wave soldering equipment setup, parameter configuration, and routine maintenance; and managing soldering yields and production efficiency for the DIP stage.
2. Troubleshoot process issues related to wave soldering, precision manual soldering, and component insertion; resolve batch soldering defects.
3. Develop and update DIP work instructions; train operators on operational procedures and soldering skills.
4. Manage production line changeovers and first-article inspections; supervise SOP adherence; and record production and equipment performance data.
5. Collaborate with process engineers to execute soldering process optimization and yield improvement projects.
Job Requirements
1. Technical secondary school education or higher, majoring in electronics or a related field.
2. 2+ years of experience as a DIP technician in the server PCBA or broader electronics industry; proficient in wave soldering equipment setup and process optimization; familiar with the full range of manual soldering and component insertion processes.
3. Knowledge of IPC-A-610 soldering standards; capable of independently troubleshooting common equipment and quality issues in the DIP process.
4. Basic English reading and writing skills; able to work a two-shift rotation.
5. Experience in process optimization for high-power component soldering is preferred.
Pay: RM2,000.00 - RM4,500.00 per month
Work Location: In person
Peringatan Penting
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