jobs in Gulf Application Engineering And Packaging

Sepenuh Masa In-Circuit Test (ICT) - Reverse Engineering Technician Jobs, in Gulf Application Engineering And Packaging Bayan Lepas - Maukerja

In-Circuit Test (ICT) - Reverse Engineering Technician

Gulf Application Engineering And Packaging

Undisclosed

Sepenuh Masa

Bayan Lepas, Pulau Pinang

Kongsi
Simpan

Lokasi Kerja

  • Bayan Lepas Pulau Pinang Malaysia

Penerangan Kerja

Tanggungjawab

Application Engineer – Electronics Manufacturing Equipment

(Relocation to Dubai – Work Visa Provided)


Location: Middle East (Relocation to Dubai – Work Visa Provided)

Company: GAEP Electronics – Authorized Representative of Seica


GAEP Electronics is seeking an experienced In-Circuit Test (ICT) & Reverse Engineering Technician to join our growing Electronics Manufacturing team. The successful candidate will support customers with PCB testing, fixture development, reverse engineering, and production test solutions using Seica's advanced flying probe and ICT platforms.


Key Responsibilities

  • Develop, debug, and optimize In-Circuit Test (ICT) programs.
  • Create and maintain flying probe test programs for PCB assemblies.
  • Perform PCB reverse engineering for legacy and undocumented boards.
  • Generate schematics, BOMs, and netlists from assembled PCBs.
  • Analyze failures and troubleshoot electronic assemblies down to component level.
  • Develop test strategies for prototype, NPI, and low-volume/high-mix production.
  • Support fixture design and validation.
  • Collaborate with customers to improve test coverage and manufacturing quality.
  • Produce technical documentation and test reports.
  • Provide on-site commissioning, training, and technical support when required.


Requirements

  • Diploma or Bachelor's degree in Electronics Engineering or related field.
  • Minimum 3 years of experience in PCB testing, ICT, flying probe testing, or electronics manufacturing.
  • Strong understanding of analog and digital electronics.
  • Experience reading schematics, PCB layouts, and Gerber files.
  • Experience with reverse engineering tools and electronic measurement equipment.
  • Knowledge of boundary scan (JTAG), functional testing, and manufacturing test methodologies is an advantage.
  • Familiarity with SMT manufacturing processes and IPC standards.
  • Excellent troubleshooting and analytical skills.
  • Willingness to travel for customer support and project implementation.


Preferred Experience

  • Seica Flying Probe Test Systems
  • In-Circuit Testing (ICT)
  • Reverse Engineering
  • PCB Failure Analysis
  • Functional Test
  • JTAG / Boundary Scan
  • AOI / AXI
  • Low-Volume High-Mix Manufacturing
  • Hands-on troubleshooting skills and ability to read electrical/mechanical drawings.
  • Excellent level of English.
  • Willing to travel within UAE & Saudi Arabia.


Join GAEP Electronics and work with cutting-edge Seica technologies while supporting some of the region's most advanced electronics manufacturers.


Interested? Send your CV and cover email to *************

Learn more about us: *************

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