Kerja Sepenuh Masa, IC Package Designer di UST Malaysia Pulau Pinang - Maukerja

We are looking for IC Package Designer to develop new IC package designs and updating existing designs. Your prime responsibility includes but not limited to: CAD designs, execution planning, 1st level debug for issue isolation and reporting.

Responsibilities

• Executing high density package layout designs across client’s product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more):
• IC package layout design including feasibility studies, substrate layout design/routing, package stack up, ballmap etc.
• Perform DRC checks, unconnected pins and dangling trace/vias and fix the design accordingly.
• Perform design self-check based on the design review checklist provided and fix the design accordingly.
• Perform design cleanup with PLA tools. (Depend on the accessibility of the PLA tools)
• Full package design including all/partial interfaces assignment as well as power assignment according to schematic that provided. Might include the component placement and constraint setting as well as other package design related request.
• Using the Mentor Graphics Xpedition PCB software to design the substrate in compliance with existing design rules, electrical requirements and processes.
• Must understand various interface requirement like DDR/PCIe/SERDES etc.
• Good technical knowledge of electrical field theories, electronic fundamentals, sound knowledge in electromagnetic and microwave theory

Job Requirements:

• Expertise in high speed PCB Design using Mentor Graphics (Xpedition VX), working knowledge in GPIO, HSSIO.
• Expertise in Net, Pin pair and combination-net (Xnets) length matching
• Expertise in CAM setup and Gerber generation
• Accustomed to designing PCB's with a high awareness of “Design for Manufacturing, Assembly, and Test” requirements
• Expertise in Edge-Coupled and Broadside-Coupled Differential pairs and Designed impedance
• Expertise in using Through–Hole, Blind, Buried, Micro & Power vias in PCB.
• Good command on critical signal routing, cross talks, EMI, EMC, Clock signal, Mixed Signal Routings and Power plane distribution.
• Experience in preparation of Fabrication and Assembly Drawings
• Advanced knowledge of constraints and use of the constraint manager
• Experience in documentation like PCB Guidelines, Processes, Checklists and Training materials.
• Bachelor's or Master's degree in Electrical/Electronics Engineering or related field with 2+ years in the related fields.

Note: Open to local candidates only.