Kerja Sepenuh Masa CIM Engineer, Gaji tinggi SGD 9,000 di SILICON BOX PTE. LTD. East Region (Singapore) - Maukerja

Position Summary

The CIM Engineer is responsible for the implementation, maintenance & development of semiconductor automation facilities.

Candidates with Semiconductor, LCD industrial automation industries or smart factory / CIM experience are encouraged to apply for this position.

Responsibilities

• Development and maintenance of Quality Management system (QMS), Facility Automation (MC) system and Logistics automation (MCS) system.
• Responsible for new automation requirement, system survey, any modifications or improvement works.
• Identify equipment failures, root cause analysis, and recommend solution for technical issues.
• Provide cross-functional cooperation and vendor interaction to troubleshoot, analyze and develop solutions for problems involving integrated systems.

Requirements

• Bachelor’s Degree in Engineering, Computer Science, IT or similar discipline.
• More than 5 years of experience in related field including 3 years of development experience.
• Quality related experience in implementation and operation (SPC, TAMS, YMS, DMS, RMS, etc.).
• Facility interface experience through facility automation solution.
• MCS solution R&D experience.
• Team player with strong analytical and problem-solving skills

Experience in the following:

• Programming languages (C, C#, .Net, etc.) and DBMS (Oracle, MS-SQL, etc.)
• SECS-I, SECS-II, HSMS/GEM, OPC, TCP/IP
• Facility and supersystem (MES, EMS, etc.) interface
• Logistics AGV, ACS for OHT control, OCS
• Smart factory/CIM implementation experience

Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.

We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.